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YOUR FUTURE RESPONSIBILITIES Lead R&D efforts on fabrication of magnetic-based RF microsystems, like circulators, antennas, or inductors, aiming for novel device innovations and industrial process developments with 200-300 mm pilot line capabiliti...
YOUR FUTURE RESPONSIBILITIES Responsibility for lithography systems, mainly track and exposure tools Develop new lithography processes Collaborate with research teams within SAL to fabricate state of the art research vehicles Ensure stable process...
YOUR FUTURE RESPONSIBILITIES Responsibility for dry etch semiconductor fabrication equipment Develop new dry etch processes for new materials Collaborate with research teams within SAL to fabricate state of the art research vehicles Ensure stable ...
YOUR FUTURE RESPONSIBILITIES Lead efforts in applied research on magnetic thin films and spintronic applications aiming for novel device innovations and industrial process developments with 200-300 mm pilot line capabilities Actively form the R&D ...
Your future responsibilities Development of new dry etch processes for new materials with a state-of-the-art etching tool Thin film surface characterization (incl.SEM, EDX, ellipsometry, AFM, XPS) Design and execution of advanced experiments, data...
YOUR FUTURE RESPONSIBILITIES In today's world, point-of-care devices such as glucose monitors have become ubiquitous, but their disposal contributes significantly to environmental waste. At SAL, we aim to address this issue by designing eco-friend...
Your future responsibilities In today's world, point-of-care devices such as glucose monitors have become ubiquitous, but their disposal contributes significantly to environmental waste. At SAL, we aim to address this issue by designing eco-friend...
YOUR FUTURE RESPONSIBILITIES Are you ready to lead groundbreaking research in advanced technologies and shape the future of innovation? Join our Heterogeneous Integration Technologies team in Villach, Austria. You are going to address cutting-edge...
YOUR FUTURE RESPONSIBILITIES Development of magnetron sputtering processes for piezoelectric nitrides (AlN, AlScN, AlXN) on wide band gap substrates (SiC, GaN) with a state-of-the-art cluster tool Design of layer stack and process development for ...