You will be responsible for developing new die bonding processes and will particicpate in research activities where Die to wafer bonding is required (3D integrated systems, image sensors, photonics, biomedical devices).
Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation programs and bilateral initiatives, imec contributes to the state of the art in a significant manner. Thanks to recent advances in 3D integration, wafer-level packaging and MEMS, novel types of components with small form factors and an increased number of functionalities are emerging. These novel components also require new packaging solutions. To support the growing interest in these activities, we are looking for an R&D Engineer for Die to Wafer bonding.
You are member of the Bonding, Transfer and Assembly Group (BTA), which is responsible for developing processes requested by the process integration departments running imec’s CORE and CMORE programs. You work in a team of about ten people with whom you interact daily. You will work in a dynamic multidisciplinary and multicultural environment in close cooperation with Researchers, Scientists, Hardware Engineers, Operations, Equipment Vendors, Industrial Assignees, Device and Process experts.
As a specialist, you will be responsible for developing new die bonding process. For this, you work mainly in the cleanroom and you are supported by experienced technical staff to carry out standard operations. Secondly, you are involved in research activities where Die to wafer bonding is required (3D integrated systems, image sensors, photonics, biomedical devices).
More specifically, you will:
You will be coached on-the-job by senior researchers.
We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.
We are proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.
We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a competitive salary with many fringe benefits.
|Title||R&D Engineer Die to Wafer bonding|
|Job location||Kapeldreef 75, B-3001 Heverlee|
|Published||March 2, 2021|
|Job types||Engineer  |
|Fields||Materials Engineering,   Biomedical Engineering,   Materials Chemistry,   Polymer Chemistry,   Materials Physics,   Photonics  |